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SPI 2026 – 30th IEEE Workshop on Signal and Power Integrity

SPI 2026 – 30th IEEE Workshop on Signal and Power Integrity

June 14-17, 2026 – Turin, Italy

  • Welcome
  • Committees
  • About SPI
  • Call for Papers
  • Paper Submission
  • Awards & Grants
  • Sponsorships
  • Program
  • Featured Sessions
  • Global SIPI University
  • IBIS Summit
  • Registration
  • Venue
  • Travel & Accommodation
  • Important Dates
  • Workshop Files
  • Contacts

Workshop Files

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SPI 2026 CFP flyer G-SIPI-U @ SPI 2026 Course flyer
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SPI 2026 Presentation Guidelines SPI 2026 Preliminary Program
PresentationGuidelines.PDF PreliminaryProgram.PDF

 

Newsletters
September 8, 2025 Save the Date: IEEE SPI 2026 – June 14-17 – Turin, Italy
October 9, 2025 Venue Reveal: Discover the Workshop Locations >> IEEE SPI 2026
November 5, 2025 Paper Submission OPEN & Global SIPI University >> IEEE SPI 2026
December 10, 2025 Program Highlights: Global SIPI University Instructors >> IEEE SPI 2026
January 16, 2026 Deadline Extension & Program Highlights >> IEEE SPI 2026
February 4, 2026 Final Deadline this Friday & Program Highlights >> IEEE SPI 2026
March 12, 2026 Registration Deadlines Fast Approaching >> IEEE SPI 2026
April 23, 2026 Preliminary Program Released: Explore the Full Lineup >> IEEE SPI 2026

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Dr. Gianni Signorini

Gianni Signorini holds a B.Sc. and M.Sc. (with honours) in Electronics Engineering from the University of Pisa, Italy, and a Ph.D. degree in Information Engineering from the same institution. From 2011 to 2018, he was with Intel Corporation (Munich, Germany) where he conducted research on Signal and Power Integrity co-simulations and methodology development in collaboration with the Department of Electronics and Telecommunications (DET) at Politecnico di Torino, Italy. Since 2019, Gianni Signorini has been with Apple (Munich, Germany) where he leads an international team that is responsible for Power Integrity simulations of several Apple SoCs. Gianni Signorini was the recipient of 2015 IEEE SPI Best Student Paper Award. He has published several articles in IEEE journals and international conferences.

LinkedIn Profile

Dr. Kaladhar Radhakrishnan

Kaladhar Radhakrishnan is an Intel Fellow and a Power Delivery Architect with the Technology Development group at Intel. He has played a significant role in shaping and driving power delivery technologies for Intel microprocessors. His areas of expertise are in integrated voltage regulators, advanced packaging and passives technologies. Kaladhar is a two-time recipient of the Intel Achievement Award. He has authored 4 book chapters, over 50 technical papers in peer reviewed journals, and has been awarded 50 US patents. Kaladhar joined Intel in 2000 after he received his Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign, USA.

LinkedIn Profile

Dr. Wendem Beyene

Wendem Beyene (IEEE Fellow) is an Analog and Mixed-Signal Architect at Meta Platforms. He previously held technical and leadership roles at IBM, Hewlett-Packard, Agilent Technologies, Rambus, and Intel. He serves as a Senior Area Editor for the IEEE Transactions on CPMT. He has been a Distinguished Lecturer for the IEEE EPS society since 2020 and served for IEEE EMC society in the past. Dr. Beyene has taught university-level courses in signal and power integrity and computer methods for circuit analysis and design. He has also served as General Chair for several IEEE conferences and is an Associate Fellow of the Ethiopian Academy of Sciences. Since 2022, he has organized the annual IEEE EPS– and EDS–sponsored DTMES conference in Addis Ababa, Ethiopia.

LinkedIn Profile

Giordano Mariani

Giordano Mariani received the M.S. degree in Electrical Engineering from La Sapienza University in Rome in 2018. In the same year he joined a startup in the Netherlands, working on integrated photonics and specializing in RF testing, design and simulation. In 2022 he joined Rohde & Schwarz Italy as an application engineer. He focuses on applications for the Aerospace and Defense market, such as satellite testing, GNSS and RF component characterization. He has a strong background in VNA measurements and characterization of PCBs and transmission lines from a signal integrity perspective.

LinkedIn Profile

Dr. Andreas Hardock

Andreas Hardock (IEEE Senior Member) studied nanostructure technology at the Julius Maximilian University of Würzburg and did his PhD in the field of functional vias at the Technical University of Hamburg-Harburg. He began his professional career in 2015 in the automotive industry as an EMC engineer at Behr-Hella Thermocontrol. From 2016 to 2020, he worked at Continental Automotive GmbH in Babenhausen, serving as a hardware architect responsible for SI/PI, EMC, and ESD topics in product development. In 2020, Andreas joined Nexperia in the group of Product Application, focusing on ESD and EMC technologies and products for the automotive sector. He is a Senior Member of the IEEE and has been part of the EMC Society since 2011. Since 2019, he has been an active contributor to the IEEE German EMC Chapter.

LinkedIn Profile

Aman Gupta

Aman Gupta was born in Raniganj, India. He received the MTech. degree in Microelectronics from BITS Pilani, Rajasthan, India, in 2023. In 2019, he joined Bosch Global Software Technologies, Bengaluru, India, where he was working as a Senior EMC Engineer. In 2023, he joined Valeo, Bietigheim-Bissingen, Germany, as an EMC Design Engineer and is currently working with NXP Semiconductors, Hamburg, Germany, as an EMC Engineer. He has authored in three technical papers, which includes one Journal on Antenna Design. His recent research interests include antenna design, electromagnetic interference/EMC, wireless communication.

LinkedIn Profile

Dipl.-Ing. Peter Hank

Peter Hank is Senior Manager for Ethernet Applications at NXP Semiconductors in Hamburg, Germany. He studied Electronic Engineering in Hamburg and joined Philips in 1986. His background includes various fields of digital and analog system design, microcontrollers and software for automotive. Solutions for Controller Area Networks (CAN), FlexRay and Electromagnetic Compatibility were major activities over many years. In this function he led working groups and technical committees and contributed as work package leader to European funded projects. Today he is primarily working on mixed-signal solutions for high-speed Automotive Ethernet and is managing a group with the responsibility for Ethernet Applications.

LinkedIn Profile

Dr. Xiaomin Duan

Xiaomin Duan (IEEE Senior Member) is currently technical lead responsible for IBM Z processor packaging design and integration. He received the M.S. degree in microelectronics and microsystems and the Ph.D. degree in electrical engineering from the Hamburg University of Technology, Hamburg, Germany, in 2007 and 2012, respectively. He was a Post-Doctoral Researcher with the Institute of Electromagnetic Theory, Technical University of Hamburg, from 2012 to 2013, and the RF and High Speed Group, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany, from 2013 to 2015. Since 2016, he has been with IBM Germany Research & Development GmbH, Germany.

LinkedIn Profile

Prof. Francesco de Paulis

Francesco de Paulis (IEEE Senior Member) received the M.S. degree in Electrical Engineering in May 2008 from Missouri University of Science and Technology (formerly University of Missouri-Rolla), USA, and the PhD degree in Electrical and Information Engineering in 2012 from the University of L’Aquila, Italy. He is currently an Associate Professor at the Electromagnetic Compatibility and Signal Integrity Laboratory, University of L’Aquila, and an Adjunct Professor at the Missouri University of Science and Technology. He serves as Guest Editor for the IEEE Transactions on Signal and Power Integrity and as Associate Editor for the IEEE Transactions on Instrumentation and Measurements. He is a member of the Board of Governors of the IEEE EMC Society (2025-2027). His main research interests are in signal and power integrity, high speed channel design, electromagnetic compatibility, antenna design and measurement techniques.

Institutional Webpage     LinkedIn Profile

Prof. Christian Schuster

Christian Schuster (IEEE Fellow) received a Diploma degree in physics in 1996 and a Ph.D. degree in electrical engineering in 2000. Since 2006 he is a full professor at Hamburg University of Technology (TUHH), Germany. Prior to TUHH he was with the IBM T. J. Watson Research Center, Yorktown Heights, NY, USA. His interests include signal and power integrity of digital systems, multiport measurement and calibration techniques, and development of physics-based as well as data-based modeling, simulation and optimization methods for EMC+SIPI. In the recent past, he has served as an Associate Editor for the IEEE Transactions on EMC, as an Adjunct Associate Professor at the School of Electrical and Computer Engineering of the Georgia Institute of Technology, and as the President of the NIT Northern School of Technology Management at TUHH.

Institutional Webpage     LinkedIn Profile

 

Edition Year Date Country Venue Chair(s) Affiliation
1 1997 May 14-16 Germany Travemünde Joachim P. Mucha
Hartmut Grabinski
University of Hannover
2 1998 May 13-15 Germany Travemünde Joachim P. Mucha
Hartmut Grabinski
University of Hannover
3 1999 May 19-21 Germany Titisee-Neustadt Joachim P. Mucha
Hartmut Grabinski
University of Hannover
4 2000 May 17-19 Germany Magdeburg Joachim P. Mucha
Hartmut Grabinski
University of Hannover
5 2001 May 13-16 Italy Venice Flavio G. Canavero
Ivan A. Maio
Politecnico di Torino
6 2002 May 12-15 Italy Pisa Flavio G. Canavero
Ivan A. Maio
Politecnico di Torino
7 2003 May 11-14 Italy Siena Flavio G. Canavero
Ivan A. Maio
Politecnico di Torino
8 2004 May 09-12 Germany Heidelberg Hartmut Grabinski
Uwe Arz
University of Hannover
PTB Braunschweig
9 2005 May 10-13 Germany Garmisch-Partenkirchen Hartmut Grabinski
Uwe Arz
University of Hannover
PTB Braunschweig
10 2006 May 09-12 Germany Berlin Hartmut Grabinski
Uwe Arz
University of Hannover
PTB Braunschweig
11 2007 May 13-16 Italy Ruta di Camogli Flavio G. Canavero
Ivan A. Maio
Politecnico di Torino
12 2008 May 12-15 France Avignon Denis Deschacht
Fabrice Huret
University of Montpellier
University of Brest
13 2009 May 12-15 France Strasbourg Denis Deschacht
Fabrice Huret
University of Montpellier
University of Brest
14 2010 May 09-12 Germany Hildesheim Hartmut Grabinski
Uwe Arz
University of Hannover
PTB Braunschweig
15 2011 May 08-11 Italy Naples Antonio Maffucci
Giovanni Miano
University of Cassino and Southern Lazio
University of Naples
16 2012 May 13-16 Italy Sorrento Antonio Maffucci
Giovanni Miano
University of Cassino and Southern Lazio
University of Naples
17 2013 May 12-15 France Paris Jose Schutt-Ainé University of Illinois
18 2014 May 11-14 Belgium Ghent Daniel De Zutter Ghent University
19 2015 May 10-13 Germany Berlin Ivan Ndip Fraunhofer IZM
20 2016 May 08-11 Italy Turin Stefano Grivet-Talocia Politecnico di Torino
21 2017 May 07-10 Italy Lake Maggiore Stefano Grivet-Talocia Politecnico di Torino
22 2018 May 22-25 France Brest Mihai Telescu University of Brest
23 2019 June 18-21 France Chambéry Mihai Telescu University of Brest
24 2020 Cancelled due to COVID-19 Elmar Griese
Thomas Kühler
University of Siegen
25 2021 May 10-12 Germany Online Conference Elmar Griese
Thomas Kühler
University of Siegen
26 2022 May 22-25 Germany Siegen Elmar Griese
Thomas Kühler
University of Siegen
27 2023 May 07-10 Portugal Aveiro Joana Catarina Mendes
Stefano Grivet-Talocia
Instituto de Telecomunicações
Politecnico di Torino
28 2024 May 12-15 Portugal Lisbon Joana Catarina Mendes
Nuno Horta
Instituto de Telecomunicações
29 2025 May 11-14 Italy Gaeta Antonio Maffucci University of Cassino and Southern Lazio
30 2026 June 14-17 Italy Turin Paolo Manfredi Politecnico di Torino