Dr. Xiaomin Duan
Xiaomin Duan (IEEE Senior Member) is currently technical lead responsible for IBM Z processor packaging design and integration. He received the M.S. degree in microelectronics and microsystems and the Ph.D. degree in electrical engineering from the Hamburg University of Technology, Hamburg, Germany, in 2007 and 2012, respectively. He was a Post-Doctoral Researcher with the Institute of Electromagnetic Theory, Technical University of Hamburg, from 2012 to 2013, and the RF and High Speed Group, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany, from 2013 to 2015. Since 2016, he has been with IBM Germany Research & Development GmbH, Germany.
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