SPI 2026 – 30th IEEE Workshop on Signal and Power Integrity
June 14-17, 2026 – Turin, Italy
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The PDF file provides comprehensive event information, including the full Program.
The PDF file provides the definitive event record, including the official final Program.
Gianni Signorini holds a B.Sc. and M.Sc. (with honours) in Electronics Engineering from the University of Pisa, Italy, and a Ph.D. degree in Information Engineering from the same institution. From 2011 to 2018, he was with Intel Corporation (Munich, Germany) where he conducted research on Signal and Power Integrity co-simulations and methodology development in collaboration with the Department of Electronics and Telecommunications (DET) at Politecnico di Torino, Italy. Since 2019, Gianni Signorini has been with Apple (Munich, Germany) where he leads an international team that is responsible for Power Integrity simulations of several Apple SoCs. Gianni Signorini was the recipient of 2015 IEEE SPI Best Student Paper Award. He has published several articles in IEEE journals and international conferences.
Kaladhar Radhakrishnan is an Intel Fellow and a Power Delivery Architect with the Technology Development group at Intel. He has played a significant role in shaping and driving power delivery technologies for Intel microprocessors. His areas of expertise are in integrated voltage regulators, advanced packaging and passives technologies. Kaladhar is a two-time recipient of the Intel Achievement Award. He has authored 4 book chapters, over 50 technical papers in peer reviewed journals, and has been awarded 50 US patents. Kaladhar joined Intel in 2000 after he received his Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign, USA.
Wendem Beyene (IEEE Fellow) is an Analog and Mixed-Signal Architect at Meta Platforms. He previously held technical and leadership roles at IBM, Hewlett-Packard, Agilent Technologies, Rambus, and Intel. He serves as a Senior Area Editor for the IEEE Transactions on CPMT. He has been a Distinguished Lecturer for the IEEE EPS society since 2020 and served for IEEE EMC society in the past. Dr. Beyene has taught university-level courses in signal and power integrity and computer methods for circuit analysis and design. He has also served as General Chair for several IEEE conferences and is an Associate Fellow of the Ethiopian Academy of Sciences. Since 2022, he has organized the annual IEEE EPS– and EDS–sponsored DTMES conference in Addis Ababa, Ethiopia.
Giordano Mariani received the M.S. degree in Electrical Engineering from La Sapienza University in Rome in 2018. In the same year he joined a startup in the Netherlands, working on integrated photonics and specializing in RF testing, design and simulation. In 2022 he joined Rohde & Schwarz Italy as an application engineer. He focuses on applications for the Aerospace and Defense market, such as satellite testing, GNSS and RF component characterization. He has a strong background in VNA measurements and characterization of PCBs and transmission lines from a signal integrity perspective.
Andreas Hardock (IEEE Senior Member) studied nanostructure technology at the Julius Maximilian University of Würzburg and did his PhD in the field of functional vias at the Technical University of Hamburg-Harburg. He began his professional career in 2015 in the automotive industry as an EMC engineer at Behr-Hella Thermocontrol. From 2016 to 2020, he worked at Continental Automotive GmbH in Babenhausen, serving as a hardware architect responsible for SI/PI, EMC, and ESD topics in product development. In 2020, Andreas joined Nexperia in the group of Product Application, focusing on ESD and EMC technologies and products for the automotive sector. He is a Senior Member of the IEEE and has been part of the EMC Society since 2011. Since 2019, he has been an active contributor to the IEEE German EMC Chapter.
Aman Gupta was born in Raniganj, India. He received the MTech. degree in Microelectronics from BITS Pilani, Rajasthan, India, in 2023. In 2019, he joined Bosch Global Software Technologies, Bengaluru, India, where he was working as a Senior EMC Engineer. In 2023, he joined Valeo, Bietigheim-Bissingen, Germany, as an EMC Design Engineer and is currently working with NXP Semiconductors, Hamburg, Germany, as an EMC Engineer. He has authored in three technical papers, which includes one Journal on Antenna Design. His recent research interests include antenna design, electromagnetic interference/EMC, wireless communication.
Peter Hank is Senior Manager for Ethernet Applications at NXP Semiconductors in Hamburg, Germany. He studied Electronic Engineering in Hamburg and joined Philips in 1986. His background includes various fields of digital and analog system design, microcontrollers and software for automotive. Solutions for Controller Area Networks (CAN), FlexRay and Electromagnetic Compatibility were major activities over many years. In this function he led working groups and technical committees and contributed as work package leader to European funded projects. Today he is primarily working on mixed-signal solutions for high-speed Automotive Ethernet and is managing a group with the responsibility for Ethernet Applications.
Xiaomin Duan (IEEE Senior Member) is currently technical lead responsible for IBM Z processor packaging design and integration. He received the M.S. degree in microelectronics and microsystems and the Ph.D. degree in electrical engineering from the Hamburg University of Technology, Hamburg, Germany, in 2007 and 2012, respectively. He was a Post-Doctoral Researcher with the Institute of Electromagnetic Theory, Technical University of Hamburg, from 2012 to 2013, and the RF and High Speed Group, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany, from 2013 to 2015. Since 2016, he has been with IBM Germany Research & Development GmbH, Germany.
Francesco de Paulis (IEEE Senior Member) received the M.S. degree in Electrical Engineering in May 2008 from Missouri University of Science and Technology (formerly University of Missouri-Rolla), USA, and the PhD degree in Electrical and Information Engineering in 2012 from the University of L’Aquila, Italy. He is currently an Associate Professor at the Electromagnetic Compatibility and Signal Integrity Laboratory, University of L’Aquila, and an Adjunct Professor at the Missouri University of Science and Technology. He serves as Guest Editor for the IEEE Transactions on Signal and Power Integrity and as Associate Editor for the IEEE Transactions on Instrumentation and Measurements. He is a member of the Board of Governors of the IEEE EMC Society (2025-2027). His main research interests are in signal and power integrity, high speed channel design, electromagnetic compatibility, antenna design and measurement techniques.
Christian Schuster (IEEE Fellow) received a Diploma degree in physics in 1996 and a Ph.D. degree in electrical engineering in 2000. Since 2006 he is a full professor at Hamburg University of Technology (TUHH), Germany. Prior to TUHH he was with the IBM T. J. Watson Research Center, Yorktown Heights, NY, USA. His interests include signal and power integrity of digital systems, multiport measurement and calibration techniques, and development of physics-based as well as data-based modeling, simulation and optimization methods for EMC+SIPI. In the recent past, he has served as an Associate Editor for the IEEE Transactions on EMC, as an Adjunct Associate Professor at the School of Electrical and Computer Engineering of the Georgia Institute of Technology, and as the President of the NIT Northern School of Technology Management at TUHH.
| Edition | Year | Date | Country | Venue | Chair(s) | Affiliation |
| 1 | 1997 | May 14-16 | Germany | Travemünde | Joachim P. Mucha Hartmut Grabinski |
University of Hannover |
| 2 | 1998 | May 13-15 | Germany | Travemünde | Joachim P. Mucha Hartmut Grabinski |
University of Hannover |
| 3 | 1999 | May 19-21 | Germany | Titisee-Neustadt | Joachim P. Mucha Hartmut Grabinski |
University of Hannover |
| 4 | 2000 | May 17-19 | Germany | Magdeburg | Joachim P. Mucha Hartmut Grabinski |
University of Hannover |
| 5 | 2001 | May 13-16 | Italy | Venice | Flavio G. Canavero Ivan A. Maio |
Politecnico di Torino |
| 6 | 2002 | May 12-15 | Italy | Pisa | Flavio G. Canavero Ivan A. Maio |
Politecnico di Torino |
| 7 | 2003 | May 11-14 | Italy | Siena | Flavio G. Canavero Ivan A. Maio |
Politecnico di Torino |
| 8 | 2004 | May 09-12 | Germany | Heidelberg | Hartmut Grabinski Uwe Arz |
University of Hannover PTB Braunschweig |
| 9 | 2005 | May 10-13 | Germany | Garmisch-Partenkirchen | Hartmut Grabinski Uwe Arz |
University of Hannover PTB Braunschweig |
| 10 | 2006 | May 09-12 | Germany | Berlin | Hartmut Grabinski Uwe Arz |
University of Hannover PTB Braunschweig |
| 11 | 2007 | May 13-16 | Italy | Ruta di Camogli | Flavio G. Canavero Ivan A. Maio |
Politecnico di Torino |
| 12 | 2008 | May 12-15 | France | Avignon | Denis Deschacht Fabrice Huret |
University of Montpellier University of Brest |
| 13 | 2009 | May 12-15 | France | Strasbourg | Denis Deschacht Fabrice Huret |
University of Montpellier University of Brest |
| 14 | 2010 | May 09-12 | Germany | Hildesheim | Hartmut Grabinski Uwe Arz |
University of Hannover PTB Braunschweig |
| 15 | 2011 | May 08-11 | Italy | Naples | Antonio Maffucci Giovanni Miano |
University of Cassino and Southern Lazio University of Naples |
| 16 | 2012 | May 13-16 | Italy | Sorrento | Antonio Maffucci Giovanni Miano |
University of Cassino and Southern Lazio University of Naples |
| 17 | 2013 | May 12-15 | France | Paris | Jose Schutt-Ainé | University of Illinois |
| 18 | 2014 | May 11-14 | Belgium | Ghent | Daniel De Zutter | Ghent University |
| 19 | 2015 | May 10-13 | Germany | Berlin | Ivan Ndip | Fraunhofer IZM |
| 20 | 2016 | May 08-11 | Italy | Turin | Stefano Grivet-Talocia | Politecnico di Torino |
| 21 | 2017 | May 07-10 | Italy | Lake Maggiore | Stefano Grivet-Talocia | Politecnico di Torino |
| 22 | 2018 | May 22-25 | France | Brest | Mihai Telescu | University of Brest |
| 23 | 2019 | June 18-21 | France | Chambéry | Mihai Telescu | University of Brest |
| 24 | 2020 | Cancelled due to COVID-19 | Elmar Griese Thomas Kühler |
University of Siegen | ||
| 25 | 2021 | May 10-12 | Germany | Online Conference | Elmar Griese Thomas Kühler |
University of Siegen |
| 26 | 2022 | May 22-25 | Germany | Siegen | Elmar Griese Thomas Kühler |
University of Siegen |
| 27 | 2023 | May 07-10 | Portugal | Aveiro | Joana Catarina Mendes Stefano Grivet-Talocia |
Instituto de Telecomunicações Politecnico di Torino |
| 28 | 2024 | May 12-15 | Portugal | Lisbon | Joana Catarina Mendes Nuno Horta |
Instituto de Telecomunicações |
| 29 | 2025 | May 11-14 | Italy | Gaeta | Antonio Maffucci | University of Cassino and Southern Lazio |
| 30 | 2026 | June 14-17 | Italy | Turin | Paolo Manfredi | Politecnico di Torino |