Call for Papers

IMPORTANT DATES

➤ Paper Submission Opening: October 7, 2026 ➤ Full Paper Submission: January 8, 2027 ➤ Notification of Acceptance: February 1, 2027 ➤ Final Paper Submission: March 1, 2027

 

The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. All contributions will undergo a rigorous review process, conducted by the TPC. Instructions for manuscript submission will be made available upon paper submission opening.

TOPICS

• Modeling and simulation for SI/PI • Coupled signal and power integrity analysis • Noise reduction and equalization techniques • High-speed link design and modeling • Power distribution networks • RF/microwave/mm-wave systems and packaging solutions • Antennas-in-package and antennas-on-chip • 3D IC and packages (TSV/SiP/SoC) • Nano-interconnects and nano-structures • Electromagnetic theory and modeling

• Transmission line theory and modeling • Macromodeling, reduced order models • Electromagnetic compatibility • Design methodology/flow measurements • Jitter and noise modeling • Stochastic/sensitivity analysis • Electro-thermal modeling • Chip-package co-design • Novel CAD concepts • Optical interconnects • AI in electronics design

➤ Accepted papers with a Regular or a Student registration paid in full will be included in the workshop’s program and submitted for inclusion into IEEE Xplore^® (subject to meeting scope and quality requirements for IEEE Xplore^®).