Call for Papers

IMPORTANT DATES

➤ Paper Submission Opening: October 7, 2026 ✅ ➤ Full Paper Submission: January 8, 2027 ➤ Notification of Acceptance: February 1, 2027 ➤ Final Paper Submission: March 1, 2027

 

The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity, related to the topics of interest below. All contributions will undergo a rigorous review process, conducted by the TPC. Instructions for manuscript submission are available in the Paper Submission menu.

 

TOPICS

• Modeling and simulation for SI/PI • Coupled signal and power integrity analysis • Noise reduction and equalization techniques • High-speed link design and modeling • Power distribution networks • RF/microwave/mm-wave systems and packaging solutions • Antennas-in-package and antennas-on-chip • 3D IC and packages (TSV/SiP/SoC) • Nano-interconnects and nano-structures • Electromagnetic theory and modeling

• Transmission line theory and modeling • Macromodeling, reduced order models • Electromagnetic compatibility • Design methodology/flow measurements • Jitter and noise modeling • Stochastic/sensitivity analysis • Electro-thermal modeling • Chip-package co-design • Novel CAD concepts • Optical interconnects • AI in electronics design

 

➤ Each accepted paper requires a Regular or a Student registration paid in full to be included in the workshop’s program and submitted for inclusion into the SPI Proceedings on IEEE Xplore® (subject to meeting scope and quality requirements for IEEE Xplore®).

➤ Authors of the best-ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology.